16k Multifield TDI Camera Enters Volume Production

Teledyne DALSA’s new Linea™ HS camera can capture three images at once in a single scan using light sources at different wavelengths, boosting inspection system throughput and improving detectability. By DA Editor / 11 Apr 2022

Teledyne DALSA has announced that its Linea™ HS 16k Multifield TDI camera is in volume production. The Linea HS 16k Multifield can capture up to three images simultaneously in a single scan using light sources at different wavelengths. Its charge-domain CMOS TDI sensor with 16k x (64+128+64) TDI arrays and a 5×5 μm pixel size, uses advanced wafer-level coated dichroic filters with minimal spectral crosstalk to spectrally isolate the three images. The camera also comes with high-speed CLHS interface, delivering up to 8.4 Gigapixels per second over a single and long length fiber optic cable.

The camera significantly improves inspection speeds and image quality. The need for multiple scans is eliminated, thereby boosting inspection system throughput and improving detectability with minimum impact from mechanical vibration. The Linea HS is ideally suited for applications such as inspection of flat panel displays, printed circuit boards (PCB), and semi-conductor wafers; web inspection of film and metal foil; general purpose machine vision and life science applications.

“Advanced multifield imaging technology is what differentiates the Linea HS 16k Multifield camera from other line scan cameras,” said Xing-Fei He, Senior Product Manager, Teledyne DALSA. “The dichroic filters overcome spectral crosstalk of traditional color filters and enable image isolation within the spectral domain.”

The camera can also be used for color imaging with a white light source. The spectral characteristics of dichroic filters provide unique color representation that can be used to improve detectability.

Key Features:

  • Captures three field images at once in a single scan
  • High speed line rate of 133 kHz x 3
  • High sensitivity multi-array TDI
  • Bi-directional scanning
  • Assisted alignment marks

Posted by DA Editor Connect & Contact

Keep up to date with the latest news and
technical developments in Unmanned Systems.

Sign up to the UST weekly eBrief

By clicking "Sign me up" I consent to my personal information being processed for the purpose of sending me the 'eBrief' weekly e-newsletter. See our Website privacy policy.