Teledyne DALSA has announced that its Linea™ HS 16k Multiﬁeld TDI camera is in volume production. The Linea HS 16k Multifield can capture up to three images simultaneously in a single scan using light sources at different wavelengths. Its charge-domain CMOS TDI sensor with 16k x (64+128+64) TDI arrays and a 5×5 μm pixel size, uses advanced wafer-level coated dichroic ﬁlters with minimal spectral crosstalk to spectrally isolate the three images. The camera also comes with high-speed CLHS interface, delivering up to 8.4 Gigapixels per second over a single and long length fiber optic cable.
The camera significantly improves inspection speeds and image quality. The need for multiple scans is eliminated, thereby boosting inspection system throughput and improving detectability with minimum impact from mechanical vibration. The Linea HS is ideally suited for applications such as inspection of flat panel displays, printed circuit boards (PCB), and semi-conductor wafers; web inspection of film and metal foil; general purpose machine vision and life science applications.
“Advanced multifield imaging technology is what differentiates the Linea HS 16k Multiﬁeld camera from other line scan cameras,” said Xing-Fei He, Senior Product Manager, Teledyne DALSA. “The dichroic filters overcome spectral crosstalk of traditional color filters and enable image isolation within the spectral domain.”
The camera can also be used for color imaging with a white light source. The spectral characteristics of dichroic filters provide unique color representation that can be used to improve detectability.
- Captures three field images at once in a single scan
- High speed line rate of 133 kHz x 3
- High sensitivity multi-array TDI
- Bi-directional scanning
- Assisted alignment marks