Valens Semiconductor announced that its VA7000 chipsets serve as the core connectivity solution for a new, comprehensive camera-to-processor MIPI A-PHY platform introduced by D3 Embedded. This platform is notable as the first product-ready solution designed for implementing the high-performance A-PHY connectivity standard in embedded vision systems. It aims to provide users with enhanced EMI resilience, extended link distances, and compatibility with simple, low-cost cabling.
Gili Friedman, Head of the Cross-Industry Business Unit at Valens Semiconductor, stated, “D3 Embedded’s comprehensive camera-to-processor platform is a practical, ready-to-deploy solution that significantly lowers the barrier to entry for companies looking to adopt A-PHY in their embedded vision systems. Valens sees significant demand for MIPI A-PHY in this market, and we look forward to seeing how this collaboration between our companies will lead to broad adoption of A-PHY, changing the way embedded vision and AI systems are deployed across industries.”
Scott Reardon, CEO of D3 Embedded, commented on the significance of the technology, saying, “A-PHY’s ability to deliver high-speed data over long distances with exceptional electromagnetic compatibility is a game-changer for the industry. Investing in this technology was crucial because it addresses the key challenges our customers face – reliable connectivity in harsh environments and simplified system design, including the industry’s first ever use of Unshielded Twisted Pair (UTP) channels for multi-gig use cases. By building this platform around MIPI A-PHY and partnering with Valens Semiconductor, we’re giving developers a powerful, flexible toolset to accelerate innovation in embedded vision.”
The D3 Embedded platform’s compute side features an NVIDIA® Jetson Orin™ processor (NX or Nano) and includes 8 A-PHY input ports, each operating at 8Gbps (7.2Gbps net). An industrial, fanless enclosure option is available. For the camera side, D3 Embedded offers six A-PHY DesignCore® Discovery Series SKUs, all integrating the Sony ISX031 sensor. Each camera has an option for a ruggedized IP69K enclosure, providing protection against dust, liquid, and chemicals, and includes a removable, anti-reflective, scratch-resistant lens cover for harsh environments. D3 Embedded also offers custom camera development with alternative sensors upon request.
The MIPI A-PHY standard is designed to deliver high Electromagnetic Compatibility (EMC) performance, supporting reliable data transmission in electrically noisy industrial settings. Chipsets based on A-PHY technology facilitate high-speed data transmission over cables up to 30 meters and beyond without signal degradation. They also support multi-gig connectivity over both Unshielded Twisted Pair (UTP) and micro-coaxial cabling, offering design flexibility in terms of cost, weight, and mechanical needs. Additionally, A-PHY-based chipsets include built-in advanced diagnostics for link monitoring and preventive maintenance. These features make A-PHY chipsets suitable for applications such as robotics/AMR, industrial vehicles, industrial automation, and medical imaging, where long-reach, high-performance, and cost-effective connectivity is essential.
